In most audio systems, power ground—protective earth (PE) or safety ground—is mandatory and well understood. It provides a low-impedance path to clear faults and prevent electric shock. Signal ground, however, is far less standardized and often underestimated, even though it directly affects how your music is referenced and heard.
Every analog waveform swings positive and negative around a “zero” point. That reference is not universal: each manufacturer—and often each product line—implements its own grounding and reference scheme inside the chassis. When you combine components from different brands and topologies (solid-state, tube, digital front ends, etc.), their internal signal grounds and reference points don’t always align.
The result can be small but significant differences in ground potential and noise riding on what should be the zero reference. These mismatches can increase hum, hiss, and RF contamination, blur imaging, and reduce low-level resolution—even when safety grounding is technically correct.
XerXes Reference Directional Ground is engineered to bring order to the patchwork of signal and chassis grounds that exists in real‑world systems.
Used between components, it establishes a defined, low‑impedance reference network that ties disparate devices—tubes, solid‑state, digital, and video—into a shared signal and chassis ground, regardless of brand or topology. This helps align the “zero” point around which analog waveforms swing, rather than leaving each component to float at its own reference.
By providing a controlled, directional path for noise and small potential differences to be equalized, XerXes reduces hum, RF contamination, and ground‑borne interference, while improving continuity through the entire signal chain. The audible and visible results are tighter imaging, lower perceived noise, and a more coherent, stable presentation from both audio and video systems.
Conductor: Silver lattice
Effective Wire Gauge: 12
Dielectric: PTFE with varying electronegativity
Shielding: EMI/RFI internal and external
Connector Bond: Exothermic
Distortion preemption: Reactive AC and capacitive DC suppression
Geometry: Symmetrical
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