Reference Analog Cabling

Design Challenges

Analog interconnects face very different demands depending on where they’re used. Most line‑level components operate at relatively high signal levels, while phono cartridges work at extremely low levels where noise and small electrical mismatches become critical.

In both cases, the key electrical properties are impedance, capacitance, and inductive reactance. These interact with the input and output stages of your components, which can vary widely—especially when you mix solid‑state and tube gear. Poorly controlled cable parameters can roll off high frequencies, alter dynamics, or shift tonal balance.

There is also the issue of signal reference. An analog waveform swings positive and negative around a “zero” point. If two components don’t share a stable, consistent reference—because of DC offsets or differing grounding schemes—small DC errors and noise can ride on the audio signal, increasing distortion and reducing clarity

The XerXes Reference Analog Interconnect is engineered with a defined signal direction, so induced noise and parasitic energy are steered away from the active audio path as it moves downstream toward your amplification and speakers.

Its construction uses carefully chosen, multi‑layer dielectric and shielding materials, some strongly electronegative, others deliberately inert, to isolate each conductor from near‑field distortion, capacitive coupling, and external interference. This keeps cable‑induced reactance and noise to an absolute minimum.

In practice, the audible results are immediate: faster perceived attack and release, greater dynamic contrast, tighter image focus, and fully preserved low‑level harmonic detail. XerXes Reference doesn’t just pass signal; it helps create an immersive, highly resolved listening environment that feels coherent and alive.

Solution

Conductor: Silver lattice

Effective Wire Gauge: 18

Dielectric: multi-mode with varying electronegativity

Shielding: External EMI/RFI with multilayer internal decoupling

Connector Bond: Exothermic high-temperature

Distortion preemption: Directional passive energy network

Geometry: Bilateral mirror image for optimal signal retention

Base Configurations:

RCA interconnects

Constructed with two identical eutectic silver conductor cores
Conductors are independently shielded
Parallel path, noninvasive noise dissipation network

XLR interconnects

Constructed with three identical eutectic silver conductor cores
Conductors are independently shielded
Fully symmetrical ground
parallel path, noninvasive noise dissipation network

Phono interconnects

Constructed with five identical eutectic silver conductor cores
Conductors are independently shielded
Fully symmetrical ground
parallel path, noninvasive noise dissipation network
Connector choices: RCA, XLR, DIN, and 90º DIN

Xerxes